엑셀 자동화 업무 프로그램, 문서 및 양식

(강하넷) www.kangha.net PBA 작업지도서 강하넷 P B A 작 업 문서번호 IQW-4091-001 페이지 제 정 일 2001. 03. 23 1/3 지 도 서 개 정 일   개정번호 0   1. 적용범위 본 지도서는 ( 주 ) 강하넷 의 PBA 작업 공정에 대하여 적용한다 .   2. 목적 PBA 작업공정의 공정품질안정을 도모하고 생산성을 확보하여 고객이 요구하는 품질을 만족시키는데 그 목적이 있다 .   3. 용어정의 3.1 PBA : PC BOARD ASSEMBLE (Printing Circuit Board Assemble) 의 약어로서 SMT 공정을 거친 실장기판이나 SMT 공정을 거치지 아니한 PCB 에 부품을 삽입하거나 장착하여 자동납땜 , DIP 납땜 , 수납땜 작업을 말한다 . 3.2 WAVE SOLDER M/C : 자동납땜기로서 콘베어로 부품이 삽입된 기판을 투입하여 FLUX 도포 납땜등을 하는 설비 3.3 DIP POT : 전기를 이용하여 납조에 납을 녹여 부품이 삽입된 기판을 수작업으로 납땜할 수 있도록 만든 치구 3.4 C&C : CUT & CLINCHING M/C 의 약어로 PCB 에 부품을 손으로 삽입한 다음 로봇을 이용하여 기판아래에 돌출된 부품의 LEAD 를 구부리고 잘라 주는 설비를 말한다 . 3.5 수삽 : PCB 에 LEAD 가 있는 부품을 손으로 삽입하는 작업 4 . 운영절차 4.1 부품삽입작업 4.1.1 삽입부품의 규격과 수량을 확인하고 PCB 를 준비한다 . 4.1.2 SMT 공정을 거친 PCB 또는 BARE PCB 에 C&C 를 이용하거나 수작업으로 부품을 삽입한다 . 4.1.3 부품의 삽입시 일반적으로 기판에 밀착하여 작업을 하여야하며 극성이

　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 체크월 　 　 체크설비 　 　 체크자 　 　 　 작   성 　 　 승   인 　 　 AUTO SOLDER CHEEK LIST 　 　 　 　 　 　 　 　 　 　 결 　 　 　 　 　 　 　 　 　 　 　 　 　 　 재 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 195 　 194 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 193 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 192 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 191 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 190 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 189 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 188 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 187 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 186 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 185 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 히타온도 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28